HYB50G45P500AG-X4A

Name: HYB50G45P500AG-X4A
SKU: 4513
Price: 3.00 USD
Availability: InStock

Prix:$3.00

Visible LEDS FEATURES

The Yingfeng ® 5050 Surface Mount Visible LEDs are energy-efficient LEDs that can be driven at high driving current and can dissipate heat efficiently, resulting in higher reliability. Their low-profile package design addresses a wide variety of applications where superior robustness and high efficiency are required. They are packaged with ceramic-based materials, and the Silica gel lens on top of the package provides the product longevity needed for the respective end applications.The 5050 COB Surface Mount Visible LEDs are compatible with the reflow soldering process. To facilitate easy pick-and-place assembly, the Visible LEDs are packed in tape and reel. Each reel is shipped in single flux and single color bin to ensure close uniformity.
Ultra-high Watts/cm2 from high current operation maximizes performance in Medical imagingand industrial applications.
Médical & produits de qualité industrielle avec un minimum de modifications de produit pour prendre en charge le cycle de vie de plusieurs années des instruments médicaux
Wavelength range spanning from 450 to 700 nanomete
Wide range of power outputs from 400mw to 8000mw.
Lens Viewing Angles. 60
Visible High-Power LED, 2 series and 2 parallel electrical configuration. This state-of-the-art design ensures optimal performance and efficiency in delivering powerful Infrared light for various applications Yingfeng offers custom, production-scale COB modules fitted to your unique system and project reguirements. COB arrays can be targeted for specific irradiance & uniformity requirements and offer a high power, high reliability altermative to SMD arrays. Complete solution support can be provided with an optimized Visible LED array, driver selection, and cooling solution in one integrated module.

En stock:500

Visible LED 5050 Quartz glass Series

Characteristics of the

Wide range of visible wavelengths: 440 nm à 690 nm.
2 parallel and 2 series electrical configuration
Vertical chip technology enables extremely high visible power from compact packages.
Panneaux à âme en cuivre à haute conductivité et boîtiers en céramique pour la gestion thermique.
La puce non encapsulée avec des fenêtres à profil bas facilite une irradiation élevée et un couplage efficace dans des systèmes à petite extension.